From Print to Performance: A Comparative Study of Conductive and Radiated Emissions in FR-4 PCB Technology versus Dragonfly IV Additively Manufactured Electronics

Additive manufacturing electronics (AME) is an emerging field aiming to revolutionize various industry sectors from consumer electronics to aerospace and the military. The nature of the printing technology implemented in AME devices imposes certain limitations on each solution, leading to potential issues during the use of three-dimensional (3D) manufactured products. For instance, uneven ultraviolet (UV) treatment dosage, inconsistent material formulation, and variations in the thickness of the conductive layer can result in reductions in mechanical properties, such as mechanical resistance and degradation. Additionally, they can affect electrical properties, leading to an increase in impedance, crosstalk, or ground bounce issues. Given that every electronic device must comply with the 2014/30/EU EMC directive, evaluating the performance of 3D-printed printed circuit boards (PCBs) becomes vitally important. In this study, we benchmark the 3D-printed PCB board manufactured using a DragonFly IV 3D printer against the FR-4 core PCB manufactured using standard photolithography technology. The primary goal of this study is to evaluate the radiated and conductive emissions of the wideband ultrasonic amplifier PCBs manufactured using these two different technologies. Through this evaluation, we aim to provide a comprehensive understanding of the viability and potential of 3D printing technology for PCBs, offering crucial insights into its performance compared with traditional PCB manufacturing methods.