Novel Architecture for High-performance VLSI Interconnections: Reducing Latency and Power Consumption

Traditional interconnection topologies' inadequacies typically result in latency and power consumption being the limiting factors for high-performance VLSI systems. Performance and scalability are hampered by conventional systems' excessive parasitic capacitance, inductance, and signal propagation delays. Using dynamic routing techniques and cutting-edge materials to minimize parasitic effects and maximize signal transmission, the paper proposes a revolutionary interconnection architecture that overcomes these problems. With an average delay reduction of 28% and an average power consumption reduction of 22%, the proposed method outperforms conventional methods in terms of latency and power consumption. Better thermal control and a 25% increase in throughput are also achieved with the upgraded architecture, demonstrating greater performance and scalability. The efficiency of the proposed technique to navigate around the limitations of conventional VLSI linkages is demonstrated by these results.