BISHENG: A 49.38PPM Flexible Multi-Function Printer SoC in 28nm CMOS

Innovative AI functions and imaging algorithms are important for multi-function printers (MFP) to provide good user experience. However, prior printer system on chips (SoC) using hardwired hardware or customized processors have limited flexibility and programmability. This paper proposes a flexible MFP SoC called BISHENG, which uses customized RISC-V processors and a hybrid interconnect with sequential pipeline and partial crossbar. The chip was fabricated in 28 nm CMOS. Experiment result shows that it can achieves 49.38 pages per minute (PPM) in prototype printer with a typical power 2.55 W. Keywords-System on Chip, Multi-Function Printer, Document Image Processing, On-Chip Network

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Published
2024-10-25
DOI
https://doi.org/10.1109/icta64028.2024.10860441
Primary Topic
3D IC and TSV technologies
Type
article
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article

BISHENG: A 49.38PPM Flexible Multi-Function Printer SoC in 28nm CMOS

Dongliang Xiong, Zhili Liu, Aiguo Yin, Li Ding et al.
3D IC and TSV technologies
article

BISHENG: A 49.38PPM Flexible Multi-Function Printer SoC in 28nm CMOS

Dongliang Xiong, Zhili Liu, Aiguo Yin, Li Ding, Peiyong Zhang, Siwen Xiu, Xiaoxu Zhang, Kai Huang, Dandan Zheng
article en

Abstract

Innovative AI functions and imaging algorithms are important for multi-function printers (MFP) to provide good user experience. However, prior printer system on chips (SoC) using hardwired hardware or customized processors have limited flexibility and programmability. This paper proposes a flexible MFP SoC called BISHENG, which uses customized RISC-V processors and a hybrid interconnect with sequential pipeline and partial crossbar. The chip was fabricated in 28 nm CMOS. Experiment result shows that it can achieves 49.38 pages per minute (PPM) in prototype printer with a typical power 2.55 W. Keywords-System on Chip, Multi-Function Printer, Document Image Processing, On-Chip Network

China Jiliang University (CN), Zhejiang Gongshang University (CN), Zhejiang University (CN)
Affordable and clean energy
Openalex Percentile: Top 75%
3D IC and TSV technologies
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