Design and Packaging of a W Band CMOS Power Amplifier
This article presents the design and packaging of a W-band CMOS power amplifier (PA). The power amplifier utilizes transformer-based matching networks. A low-loss packaging method is proposed and applied to the power amplifier, accompanied by a co-simulation of the PA’s design and packaging. Measurement results show that the packaged PA achieves a small signal gain of 15 dB and a saturated power of 18 dBm within 90 to 100 GHz, with a maximum power added efficiency of $18 \%$.
Authors
- Liang Zhou (ORCID: https://orcid.org/0000-0003-4989-5004)
- Jixuan Wang
- Zhaoxiang Ren
- Weilin Xu (ORCID: https://orcid.org/0000-0003-2202-3476)
- Jian Pang (ORCID: https://orcid.org/0000-0002-6278-6294)
- Dong-Xin Ni (ORCID: https://orcid.org/0000-0002-7814-6240)
- Shang Zhang (ORCID: https://orcid.org/0000-0002-4045-714X)
Institutions
- Shanghai Jiao Tong University (CN)
Publication Details
- Published
- 2024-10-25
- DOI
- https://doi.org/10.1109/icta64028.2024.10860387
- Primary Topic
- Electronic Packaging and Soldering Technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.00