Thermal Stress and Impact Factors for the Embedded Silicon Bridge (EMIB) in a Chiplet Package

In this study, thermal stresses in critical components of an embedded silicon bridge (EMIB) within a chiplet package were analyzed using the finite element analysis (FEA). The stress impact factors, including bump diameter-to-pitch ratios, bump distribution patterns, and EMIB thickness, were investigated through stress analysis. The results reveal that the stress is allievated with a bump diameter-to-pitch ratio of 0.3, a peripheral bump distribution effectively reduces stress, and a reduction in EMIB thickness contributes to a decrease in stress. However, the number of EMIBs and their aspect ratios have a minimal impact on stress, offering design flexibility.