Simulation-based FMEA for the reliability assessment of printed circuit boards
Simulation-based FMEA is presented as a method to estimate the reliability of printed circuit boards at the system level. A numerical simulation of relevant stress variables is combined with fatigue models and a probabilistic FMEA to determine probabilities for system level failure modes. Uncertainties of model parameters are estimated and included in the simulation to provide a comprehensive analysis of system level failure probabilities. A parametric reduced order model is used for the numerical simulation to efficiently perform the calculations with uncertain parameters. The simulation-based FMEA workflow is applied to a test printed circuit board excited by harmonic vibrations. • Presentation of a concept for quantitative FMEA based on simulation • Simulation includes material and geometry parameter uncertainties. • Parametric model order reduction considering material and geometry parameters • Determination of probability distributions for system level failure modes
Authors
- Hendrik Schmidt (ORCID: https://orcid.org/0000-0003-3300-8685)
- Moritz Hülsebrock (ORCID: https://orcid.org/0000-0002-7865-9185)
- Roland Lichtinger
- Markus Käß
Institutions
- BMW (Germany) (DE)
- Fraunhofer Institute for Structural Durability and System Reliability (DE)
Publication Details
- Journal
- Microelectronics Reliability
- Published
- 2025-02-07
- DOI
- https://doi.org/10.1016/j.microrel.2025.115613
- Citations
- 4
- Primary Topic
- Probabilistic and Robust Engineering Design
- Type
- article
- Field-Weighted Citation Impact
- 5.59