Preparation and thermal conduction mechanism of highly thermally conductive <scp>PA6</scp>/<scp>Al₂O₃</scp>/<scp>GNP</scp> composites via dynamic reactive blending

Abstract Highly thermally conductive polyamide 6 (PA6)/aluminum oxide (Al 2 O 3 )/graphene nanoplatelet (GNP) composites were fabricated through dynamic reactive blending. By utilizing the synergistic effect of low viscosity monomer and dynamic shear, uniform dispersion of Al 2 O 3 and GNP in the PA6 matrix was achieved, forming efficient thermal conductive networks. Structural and morphological analyses confirmed the homogeneous dispersion of fillers and good interfacial bonding characteristics. The results showed that when Al 2 O 3 and GNP contents were 43 and 7 wt%, respectively, the thermal conductivity reached 2.71 W/m·K, representing a 984% enhancement over neat PA6 and a 45.7% improvement compared to melt‐blended composites. The P‐S theoretical model was employed to understand the underlying mechanism, showing good agreement between theoretical calculations and experimental results. LED heat dissipation tests demonstrated excellent thermal response characteristics and temperature stability of the composites in practical thermal management applications, indicating their promising potential in electronic cooling applications. Highlights Dynamic reactive blending was used to prepare thermal conductive composites. Low viscosity of monomer and dynamic shear promoted uniform dispersion of fillers. The composites showed thermal conductivity of 2.71 W/m·K, 984% higher than neat PA6. P‐S model showed enhanced parallel effect reduced interfacial thermal resistance. Composites demonstrated effective heat dissipation in LED thermal management tests.