Improving high temperature resilience of fiber sensor embedded smart components through laser shock peening

This study explores the use of laser shock peening (LSP) to enhance material properties and high-temperature performance of fiber-sensor-fused smart parts fabricated by additive manufacturing (AM) methods. Using embedded fiber sensors as distributed strain gauges, the study demonstrates that LSP can induce compressive strains of up to 130 µε on fiber embedded 1-mm below metal surfaces. The electron backscatter diffraction (EBSD) analysis shows that, with optimized LSP parameters, the metallic matrix undergoes substantial microstructural refinement, resulting in denser structures. Thermal cycling tests showed that the LSP process can increase fiber slippage temperatures by more than 50 <sup>o</sup>C. This work shows that the LSP process is an effective room-temperature process for enhancing both surface quality and increasing fiber slippage threshold under both thermal and mechanical stress.

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Publication Details

Journal
Optics Express
Published
2025-02-05
DOI
https://doi.org/10.1364/oe.549584
Citations
1
Primary Topic
Surface Treatment and Residual Stress
Type
article
Field-Weighted Citation Impact
0.71

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Improving high temperature resilience of fiber sensor embedded smart components through laser shock peening

Qiuchi Zhu, Yuqi Li, Doan N. Nguyen, Albert C. To et al.
1 citations
Optics Express
Surface Treatment and Residual Stress
0.71
article

Improving high temperature resilience of fiber sensor embedded smart components through laser shock peening

Qiuchi Zhu, Yuqi Li, Doan N. Nguyen, Albert C. To, Shuda Zhong, Mohamed Zaghloul, Zekun Wu, Ran Zou, Kehao Zhao, Yongfeng Lu Yongfeng Lu, Qirui Wang, Guangyin Zhang, Kevin P. Chen, Guangqun Ma
article en
1 citations

Abstract

This study explores the use of laser shock peening (LSP) to enhance material properties and high-temperature performance of fiber-sensor-fused smart parts fabricated by additive manufacturing (AM) methods. Using embedded fiber sensors as distributed strain gauges, the study demonstrates that LSP can induce compressive strains of up to 130 µε on fiber embedded 1-mm below metal surfaces. The electron backscatter diffraction (EBSD) analysis shows that, with optimized LSP parameters, the metallic matrix undergoes substantial microstructural refinement, resulting in denser structures. Thermal cycling tests showed that the LSP process can increase fiber slippage temperatures by more than 50 <sup>o</sup>C. This work shows that the LSP process is an effective room-temperature process for enhancing both surface quality and increasing fiber slippage threshold under both thermal and mechanical stress.

Optics ExpressVol. 33(7)
University of Pittsburgh (US)
U.S. Department of Energy
Affordable and clean energy
Openalex Percentile: Top 36%
Surface Treatment and Residual Stress
0.71
DOIOpen Access PDFOpenAlex
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Improving high temperature resilience of fiber sensor embedded smart components through laser shock peening — Qiuchi Zhu, Yuqi Li, et al. · Optics Express (2025) | TGRS Research Map | TGRS