Scalable Multistep Roll‐to‐Roll Printing of Multifunctional and Robust Reentrant Microcavity Surfaces via a Wetting‐Induced Process (Adv. Mater. 5/2025)

Wetting-Induced Process The wetting-induced interconnected reentrant geometry (WING) process enables the large-scale fabrication of multifunctional re-entrant microcavity surfaces, representing a significant technological advancement. Utilizing capillary action in a scalable roll-to-roll printing technique, it produces surfaces with exceptional liquid repellency while maintaining microstructures under external forces. This process offers a cost-effective and high throughput solution for various applications, such as anti-icing, anti-fouling, and particle capture. More details can be found in article number 2411064 by Seok Kim, Young Tae Cho, and co-workers.

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Publication Details

Journal
Advanced Materials
Published
2025-02-01
DOI
https://doi.org/10.1002/adma.202570035
Primary Topic
Nanofabrication and Lithography Techniques
Type
article
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article

Scalable Multistep Roll‐to‐Roll Printing of Multifunctional and Robust Reentrant Microcavity Surfaces via a Wetting‐Induced Process (Adv. Mater. 5/2025)

Young Tae Cho, Nicholas X. Fang, Seo Rim Park, Kyoohee Woo et al.
Advanced Materials
Nanofabrication and Lithography Techniques
article

Scalable Multistep Roll‐to‐Roll Printing of Multifunctional and Robust Reentrant Microcavity Surfaces via a Wetting‐Induced Process (Adv. Mater. 5/2025)

Young Tae Cho, Nicholas X. Fang, Seo Rim Park, Kyoohee Woo, Su Hyun Choi, Seok Kim, Hyuntae Kim, Woo Young Kim, Seungwoo Shin, Je Min Lee, Sin Kwon
article en

Abstract

Wetting-Induced Process The wetting-induced interconnected reentrant geometry (WING) process enables the large-scale fabrication of multifunctional re-entrant microcavity surfaces, representing a significant technological advancement. Utilizing capillary action in a scalable roll-to-roll printing technique, it produces surfaces with exceptional liquid repellency while maintaining microstructures under external forces. This process offers a cost-effective and high throughput solution for various applications, such as anti-icing, anti-fouling, and particle capture. More details can be found in article number 2411064 by Seok Kim, Young Tae Cho, and co-workers.

Advanced MaterialsVol. 37(5)
Changwon National University (KR), Korea Institute of Machinery & Materials (KR), University of Hong Kong (HK)
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Openalex Percentile: Top 98%
Nanofabrication and Lithography Techniques
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