Study on the Mechanism Model of the Influence of IGBT Device Health Status on Electromagnetic Voiceprint Signals

State monitoring technology is essential for the fault prognostics and health management of power electronic devices. Electromagnetic voiceprint (EMVP) signals, produced during the switching transients of these devices, carry substantial information about their health status. In recent years, EMVP signals have gained attention as a promising state monitoring indicator for power electronic devices. However, the mechanism by which the health status of a device affects its EMVP signals remains unclear, limiting their use in health monitoring. This article investigates the impact of insulated gate bipolar transistor (IGBT) health status on EMVP signals and develops a mechanistic model to illustrate the influence of bond wire lift-off and solder aging on EMVP signals. Simulation models were developed to analyze the impact of both scenarios on EMVP signals. Typical features are proposed to characterize the relationship between IGBT health status and EMVP signal. Experimental validation supports the theoretical framework and simulation results. The research provides a theoretical foundation for the development of reliability evaluation methods based on EMVP.