Study on Reliability of Lead-free mixed BGA Soldering Process for Application of Space-grade PBA

The purpose of this study is to confirm the effect of staking and underfilling for mounting PBGA(Plastic Ball Grid Array) packaged components on satellites. With the goal of developing a process that complies with ECSS (European Cooperation for Space Standardization) standards, the effect of staking and underfilling was analyzed in terms of vibration and thermal properties, and actual test specimens were fabricated and verified. After the environmental test, microsections were performed to confirm whether cracks had actually occurred, and the rate of change in resistance value was confirmed and compared with the analysis results.