Flexible Hybrid Integration Hall Angle Sensor Compatible with the CMOS Process

Silicon-based Hall application-specific integrated circuit (ASIC) chips have become very successful, making them ideal for flexible electronic and sensor devices. In this study, we designed, simulated, and tested flexible hybrid integration angle sensors that can be made using complementary metal-oxide-semiconductor (CMOS) technology. These sensors are manufactured on a 100 µm-thick flexible polyimide (PI) membrane, which is suitable for large-scale production and has strong potential for industrial use. The Hall sensors have a sensitivity of 0.205 V/mT. Importantly, their sensitivity remains stable even after being bent to a minimum radius of 10 mm and after undergoing 100 bending cycles. The experiment shows that these flexible hybrid integration devices are promising as angle sensors.