Thermally Dependent Metastability of Indium-Tungsten-Oxide Thin-Film Transistors

Abstract Indium tungsten oxide (IWO) has been investigated as an oxide semiconductor candidate for next-generation thin-film transistors (TFTs). Bottom-gate TFTs were fabricated with a 30-nm IWO channel material sputter-deposited with oxygen partial pressure (P O2 ) ranging from 2.5% to 10% of the total ambient pressure. Annealing was conducted at temperatures ranging from 100ºC to 275ºC. Device transfer characteristic measurements revealed a pronounced interaction between the sputter P O2 setting and passivation annealing conditions. Devices annealed at 100ºC in air ambient demonstrated characteristics with a strong dependence on P O2 , attributed to differences in oxygen vacancy defects and semiconductor electronic properties. Devices annealed at 200ºC in air ambient demonstrated characteristics like those of unannealed devices, with operation far in depletion mode. Donor state passivation is possible following additional annealing at 275ºC in air, with reduced sensitivity to the initial sputter P O2 setting. A hypothesis on the mechanism of metastability is proposed.

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Publication Details

Journal
Journal of Electronic Materials
Published
2025-02-01
DOI
https://doi.org/10.1007/s11664-025-11770-5
Primary Topic
Thin-Film Transistor Technologies
Type
article
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article

Thermally Dependent Metastability of Indium-Tungsten-Oxide Thin-Film Transistors

Robert G. Manley, Karl D. Hirschman, Bin Zhu, Eli Powell et al.
Journal of Electronic Materials
Thin-Film Transistor Technologies
article

Thermally Dependent Metastability of Indium-Tungsten-Oxide Thin-Film Transistors

Robert G. Manley, Karl D. Hirschman, Bin Zhu, Eli Powell, Meghana Nagesha
article en

Abstract

Abstract Indium tungsten oxide (IWO) has been investigated as an oxide semiconductor candidate for next-generation thin-film transistors (TFTs). Bottom-gate TFTs were fabricated with a 30-nm IWO channel material sputter-deposited with oxygen partial pressure (P O2 ) ranging from 2.5% to 10% of the total ambient pressure. Annealing was conducted at temperatures ranging from 100ºC to 275ºC. Device transfer characteristic measurements revealed a pronounced interaction between the sputter P O2 setting and passivation annealing conditions. Devices annealed at 100ºC in air ambient demonstrated characteristics with a strong dependence on P O2 , attributed to differences in oxygen vacancy defects and semiconductor electronic properties. Devices annealed at 200ºC in air ambient demonstrated characteristics like those of unannealed devices, with operation far in depletion mode. Donor state passivation is possible following additional annealing at 275ºC in air, with reduced sensitivity to the initial sputter P O2 setting. A hypothesis on the mechanism of metastability is proposed.

Journal of Electronic MaterialsVol. 54(6)
Corning (United States) (US), Rochester Institute of Technology (US)
Openalex Percentile: Top 99%
Thin-Film Transistor Technologies
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Thermally Dependent Metastability of Indium-Tungsten-Oxide Thin-Film Transistors — Robert G. Manley, Karl D. Hirschman, et al. · Journal of Electronic Materials (2025) | TGRS Research Map | TGRS