Wire Bonding Failure Investigation in Semiconductor Packaging Process

The semiconductor industry is characterized by complex manufacturing processes, where precision and quality are paramount. One of the critical steps in this process is wire bonding, which connects integrated circuits to external conductors. As packaging technologies evolve rapidly, there is an increasing demand for more connections and smaller dimensions. The wire bonding process has thus become crucial, as failures in using high-quality tools can lead to significant productivity and quality management issues due to the diverse range of products and stringent control variables. Therefore, studying existing weaknesses is crucial to establishing reliable processes and reducing losses caused by failures in the manufacturing process. By checking the failure rates per stage, the wire bonding process presented the highest percentage of significant losses, and as throughout the multichip package process there are multiple wire bonding steps, the aggregate losses value increases during the process. In this way, the need to identify and prioritize problems in the wire bonding process is justified, using quality tools such as Pareto, action plan, flowchart, cause and effect diagram, among others. As a result of this study, it is aimed to reduce the cost of non-quality improving the competitiveness of the process.