Experimental Study on Pump-Driven Chiplevel Two-Phase Cooling System for Data Cabinets

An efficient water-free cooling solution for chip cooling in data centers was achieved by constructing a pumpdriven chip-level two-phase cooling system (PCTCS). The system comprises an internal cooling loop (ICL) and an external cooling loop (ECL). Within the ICL, the evaporation of refrigerant within the microchannels of the cold plate absorbs heat generated by the CPU chip, which is then transferred to the ECL via a plate heat exchanger, ultimately releasing the heat to the outdoor environment. This research analyzes the operational characteristics of the system and the impact of controlled target temperatures on the performance of the PCTCS. The findings indicate that, even during the hot summer months, the core temperature of the CPU can be maintained below 80°C, achieving natural cooling throughout the year. Increasing the control temperature helps to reduce the thermal resistance of the PCTCS. When the reservoir temperature rises by 20 °C , the core temperature of the chip only increases by 12.3°C. At reservoir temperatures of 45°C, 40°C, 35°C, and 30°C, the annual average coefficient of performance (COP) of the PCTCS are 45.6, 43.3, 38.7, and 33, respectively.