Advanced Package Evaluation Platform through Collaboration

1. Japan’s Semiconductor Industrial Policy and Strategy 2. Corporate Introduction 3. Packaging Solution Center & Co -Creative R&D Platform and JOINT2 R&D Status 1. 4. Overseas Strategy of Semiconductor Business 1. 5. Carbon Neutrality and Supply Chain Management

Authors

Hiroyuki ABE (ORCID: https://orcid.org/0000-0002-4143-3596)

Institutions

Resonac (Japan)

Publication Details

Journal: IMAPSource Proceedings
Published: 2025-01-10
DOI: https://doi.org/10.4071/001c.128219
Primary Topic: Electronic Packaging and Soldering Technologies
Type: article
Field-Weighted Citation Impact: 0.00

Funders

Ministry of Economy, Trade and Industry

Controls

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article

Advanced Package Evaluation Platform through Collaboration

Hiroyuki ABE

Jan 10, 2025

IMAPSource Proceedings

Electronic Packaging and Soldering Technologies

article

Advanced Package Evaluation Platform through Collaboration

Hiroyuki ABE

January 10, 2025article en

Abstract

IMAPSource ProceedingsVol. 2024(DPC)

Resonac (Japan)

Ministry of Economy, Trade and Industry

Openalex Percentile: Top 99%

Electronic Packaging and Soldering Technologies

DOI Open Access PDF OpenAlex

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Advanced Package Evaluation Platform through Collaboration — Hiroyuki ABE · IMAPSource Proceedings (2025) | TGRS Research Map | TGRS