Applications of White Light Interferometry in Advanced Packaging: Metrology and Quality Assurance

How White Light Interferometer profiler helps: ▪ Monitoring ▪ Controlling ▪ Optimizing Advanced Packaging 1. Die/Wafer stacking optimization 2. Through Silicon Via control 3. Bump control 4. Redistribution Layer quality

Authors

Ravi Chandra Chintala (ORCID: https://orcid.org/0000-0002-1730-580X)
Samuel Lesko
Daphne Mariaravi

Institutions

Bruker (China) (CN)

Publication Details

Journal: IMAPSource Proceedings
Published: 2025-01-28
DOI: https://doi.org/10.4071/001c.129115
Primary Topic: Material Properties and Processing
Type: article
Field-Weighted Citation Impact: 0.00

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article

Applications of White Light Interferometry in Advanced Packaging: Metrology and Quality Assurance

Ravi Chandra Chintala, Samuel Lesko, Daphne Mariaravi

Jan 28, 2025

IMAPSource Proceedings

Material Properties and Processing

article

Applications of White Light Interferometry in Advanced Packaging: Metrology and Quality Assurance

Ravi Chandra Chintala, Samuel Lesko, Daphne Mariaravi

January 28, 2025article en

Abstract

IMAPSource ProceedingsVol. 2024(DPC)

Bruker (China) (CN)

Openalex Percentile: Top 98%

Material Properties and Processing

DOI Open Access PDF OpenAlex

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Applications of White Light Interferometry in Advanced Packaging: Metrology and Quality Assurance — Ravi Chandra Chintala, Samuel Lesko, et al. · IMAPSource Proceedings (2025) | TGRS Research Map | TGRS