Custom, High Density Power Modules Enabled by Thermal Integration Technologies

Researchers at the University of Arkansas are achieving significant strides in power electronic packaging, focusing on the critical needs for high power density and integrated thermal management. They have introduced an innovative non-metallic jet impingement cooler, produced via advanced additive manufacturing techniques, which has proven to be effective in lowering thermal loads. Specifically, it reduces junction temperatures by as much as 30°C and attenuates electromagnetic interference, a crucial factor for the efficiency of high-power silicon carbide MOSFET-based inverters. In response to the 2021 PowerAmerica Institute challenge, the team engineered a high-voltage power module, achieving the specifications of 1.7-kV/1600-A within a confined volume of 100 cm³. This module exemplifies the successful integration of thermal and electrical systems in a space-efficient package, highlighting the practical resolution of high-density packaging challenges. The process has provided insights into the behavior of thermal resistance in such compact modules and the associated operational constraints. Further extending their research, the team has examined advanced cooling techniques employing dielectric fluids, targeting applications surpassing 1.2 kV. They have balanced the turbulence within fluid movement and the fluid’s voltage blocking capacity, essential for the stability of thermal management systems in high-voltage electronics. Moreover, the group has developed an empirical model for direct jet impingement cooling using dielectric fluids, optimizing for enhanced cooling performance with minimal flow rates. They are also researching in the area of two-phase immersion cooling, with a focus on maintaining electrical isolation, especially during phase changes, and conducting assessments of breakdown voltages in boiling dielectric fluids. These efforts are pivotal in guiding the next generation of efficient, compact power electronic packaging solutions, contributing significantly to the field’s future advancements.