Enabling Heterogenous Integration Through Chiplet Architectures

Advanced packaging enabled chiplet architectures are increasingly adopted to drive performance and cost improvements. New heterogeneous architectures like 2.5D Fanout, 3D and 3.5D Hybrid bonded architectures driving AMD’s industry leading advanced technology roadmap will be shared. Other topics including chiplets for AI, challenges and solutions for large chiplet modules, etc. will also be discussed.

Authors

Publication Details

Journal
IMAPSource Proceedings
Published
2025-01-10
DOI
https://doi.org/10.4071/001c.128222
Primary Topic
Interconnection Networks and Systems
Type
article
Field-Weighted Citation Impact
0.00
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article

Enabling Heterogenous Integration Through Chiplet Architectures

Hemanth Dhavaleswarapu
IMAPSource Proceedings
Interconnection Networks and Systems
article

Enabling Heterogenous Integration Through Chiplet Architectures

Hemanth Dhavaleswarapu
article en

Abstract

Advanced packaging enabled chiplet architectures are increasingly adopted to drive performance and cost improvements. New heterogeneous architectures like 2.5D Fanout, 3D and 3.5D Hybrid bonded architectures driving AMD’s industry leading advanced technology roadmap will be shared. Other topics including chiplets for AI, challenges and solutions for large chiplet modules, etc. will also be discussed.

IMAPSource ProceedingsVol. 2024(DPC)
Openalex Percentile: Top 99%
Interconnection Networks and Systems
DOIOpen Access PDFOpenAlex
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Enabling Heterogenous Integration Through Chiplet Architectures — Hemanth Dhavaleswarapu · IMAPSource Proceedings (2025) | TGRS Research Map | TGRS