Defect Modeling for Pre-bond TSV Considering Testing Frequency

To guarantee the yield of 3D-ICs, TSVs need to be tested before die bonding process. An accurate pre-bond TSV defect model is the foundation of defect testing. Conventional pre-bond TSV defect models do not consider the defect characteristics under different frequencies, which leads them not accurate enough for practical application. In this paper, we proposed pre-bond TSV RLGC equivalent lumped defect models for void, open, and pinhole defects considering testing frequency. The validity of the defect models have been proved by theoretical equations, practical measurement and Q3D simulations.