Fast Electrical-Thermal Co-Simulation with Volume-Surface Integral Equation

To achieve a fast electrical-thermal co-simulation of electronic devices, in the electromagnetic (EM) simulation stage, the EM probem is modeled by the volume-surface integral equation (VSIE) and a skeletonization based method for accelerating the MLFMA solution of VSIE is employed; in the thermal simulation stage, a parallel solver for transient heat conduction problem based on finite element method is also proposed, which is developed based on JAUMIN framework. Numerical experiments are conducted on a vivaldi antenna model to investigate the performance of the proposed fast multiphysics solver.