Research on Tungsten Heating Layer in Phase Change Switch
<tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\alpha$</tex> - W has been widely used in device heating layers due to its low electrical resistivity and high mechanical strength. This article prepared <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\alpha$</tex>-W films by selecting the thickness and annealing temperature of W films. At the same time, <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\alpha$</tex>-W thin film is used in the indirectly heating phase change switch as the heating layer. The insertion loss of this phase change switch at 1-20 GHz is less than 0.75 dB, and the isolation degree is greater than 22 dB, and the on-off resistance ratio of the switch is greater than 10<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">4</sup>. These are indicating that this switch has good performance.
Authors
- Fan He (ORCID: https://orcid.org/0009-0009-4913-1806)
- Libin Gao (ORCID: https://orcid.org/0000-0001-8198-9014)
- Hongwei Chen (ORCID: https://orcid.org/0000-0002-3881-761X)
- Mengru Li (ORCID: https://orcid.org/0000-0002-8592-6130)
- Jihua Zhang (ORCID: https://orcid.org/0000-0003-2393-0158)
- Sheng Qu (ORCID: https://orcid.org/0009-0005-9379-4958)
Institutions
- University of Electronic Science and Technology of China (CN)
Publication Details
- Published
- 2024-10-23
- DOI
- https://doi.org/10.1109/isape62431.2024.10840460
- Primary Topic
- Electronic Packaging and Soldering Technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.00