Design of Ka-Band Chip-to-Antenna Transition Structure Based on Glass Packaging Technology

The Ka-band millimeter-wave chip and its advanced packaging technology have important application value in high-speed satellite communications, 5G mobile communication, phased-array radar and other fields. In order to improve the electromagnetic transmission performance and thermal stability of the millimeter-wave on-chip integration system, and at the same time reduce the cost of process, this article proposes a ka-band chip-to-antenna transition structure based on glass packaging technology to achieve the low-loss transmission characteristics of 35 ~ 45 GHz electromagnetic signal. The results of the three-dimensional electromagnetic simulation indicate that the proposed transition structure can achieve good impedance matching in Ka band, the transmission loss is as low as 0.22 dB at 40 GHz, and it shows good impedance matching at different frequencies by regulating single structure parameter. The ka-band transition structure based on glass process in this article processing the good electromagnetic performances, good thermal stability, low process cost, and adjustable operating frequency, has rich application prospects.