An RF Signal Amplification and Power Detection 3D System-in-Package (SIP) Design Based on HDI Technology
This paper presents a 3D SIP (system in package) design of four-channel power detection and signal amplification. It used HDI(High-Density Interconnect) technology to vertically interconnect different MMIC(monolithic microwave integrated circuits), which has been validated to have minimum impact on its performance. The proposed 3D-SIP has been highly integrated into a volume of 2.05mm × 1.6mm × 0.4mm with BGA(ball grid array) output and input, the maximum receive gain is 11.3 dB at 16Ghz.
Authors
- Mengxia Yu (ORCID: https://orcid.org/0000-0002-0973-7952)
- Hao Li (ORCID: https://orcid.org/0000-0002-6336-8772)
- Shunyu He
Institutions
- University of Electronic Science and Technology of China (CN)
Publication Details
- Published
- 2024-10-23
- DOI
- https://doi.org/10.1109/isape62431.2024.10841128
- Primary Topic
- 3D IC and TSV technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.00