Successful Practice of Cultivating New Quality Productivity: Innovative Combination of Technical Parameters of SMT Equipment

The assembly process of Printed Wire Board (PWB) components is becoming increasingly intricate and multifaceted. Due to the constraints imposed by electronic component specifications and manufacturing cost considerations, the coexistence of through-hole technology and surface-mount technology (SMT) is anticipated to persist for an extended period during the transition from traditional assembly methodologies to SMT. Most enterprises adopt a dispensing process, heavily relying on parameters delineated by equipment manufacturers or experiential insights derived from production practices. When modifications occur within an enterprise's production system, there is often a marked increase in defects associated with printing quality throughout the manufacturing process, significantly escalating repair labor requirements and man-hours expended. Furthermore, any occurrences of inspection failures can disrupt normal customer operations, resulting in substantial risks related to product quality assurance. To systematically enhance the issue of surface mount quality and production capacity, reduce investment in SMT dispensing equipment, and boost enterprise competitiveness, this study employs statistical data and applies 6σ and management statistics methods, utilize MINITAB statistical software as the analysis tool, redefine high customer satisfaction and low defect criteria, conduct process analysis, and derive optimal parameters for thick mold equipment. Production practice demonstrates that these new parameters significantly enhance surface mount quality while improving overall enterprise benefits.