Transportation Product Carbon Footprint: A Framework for Semiconductor Supply Chain
This paper presents a comprehensive framework for modeling the Product Carbon Footprint (PCF) associated with the transportation activities within the semiconductor industry, specifically focusing on the gate-to-gate supply chain. The study reveals that the mode of transportation, distance traveled, and weight of shipments, particularly the weight added by packing, significantly influence the transportation PCF. Despite the inherent complexities and dependencies within the semiconductor supply chain, this research provides a robust foundation that increases transparency and facilitates comparable studies across the industry. The adaptability of the methodology shows potential for broader applications, contributing to sustainability efforts across related sectors such as the electronics industry. The study emphasizes the step-by-step methodology over quantification of carbon emissions, thereby contributing to industry-wide efforts to understand and mitigate environmental burdens.
Authors
- Young‐Jun Son (ORCID: https://orcid.org/0000-0002-4004-2155)
- Philipp Ulrich (ORCID: https://orcid.org/0000-0003-4874-6883)
- Hans Ehm
- W. Ko
- Rabia Sarilmis
Institutions
- Infineon Technologies (Germany) (DE)
- Sustainable Energy Systems (United Kingdom) (GB)
- Technical University of Munich (DE)
Publication Details
- Published
- 2024-12-15
- DOI
- https://doi.org/10.1109/wsc63780.2024.10838806
- Citations
- 1
- Primary Topic
- Recycling and Waste Management Techniques
- Type
- article
- Field-Weighted Citation Impact
- 0.29