Capacity Planning Accuracy and the Effect of Dyanmic Dedication Changes for a Single Wafer Lot Semiconductor Factory
In the context of a single wafer lot semiconductor factory characterized by high levels of Research and Development (RD) work-in-progress (WIP), low levels of product-based lots and lengthy cycle times, this paper investigates the accuracy of capacity planning given the impact of dynamic changes in dedication. We delve into several critical aspects related to dedication planning, drawing insights from historical data and dispatch logic used. The experimental results show the improvement in model accuracy with the incorporation of dedication changes as distribution functions.
Authors
- Soo Leen Low
- Boon Ping Gan (ORCID: https://orcid.org/0009-0003-1030-8762)
- H. Liu
- Keith C. C. Chan (ORCID: https://orcid.org/0000-0001-7962-6564)
- Richard Surman
- Matt Nehl
- Cole Evanson
Institutions
- Seagate (United States) (US)
- Seagate (United Kingdom) (GB)
Publication Details
- Published
- 2024-12-15
- DOI
- https://doi.org/10.1109/wsc63780.2024.10838879
- Citations
- 1
- Primary Topic
- Manufacturing Process and Optimization
- Type
- article
- Field-Weighted Citation Impact
- 0.35