A functional safety analysis approach for random hardware failure of automotive-grade chips

Automotive Grade Chips need to take into account the effects of unintended failures during operation, such as open circuits caused by chip aging or flipped memory devices caused by particle bombardment. Therefore, in the design process of automotive-grade chips, it is necessary to evaluate their safety and reliability. In this paper, we analyze the failure sources of automotive-grade chips and classify them according to the failure modes, comprehensively consider the impacts of different safety mechanisms, qualitatively and quantitatively analyze the functional safety of automotive-grade chips under transient failures, and quantify the level of protection against failures of automotive-grade chips under the transient failure conditions by means of mathematical models and evaluation indexes. The experimental results prove that it is feasible to evaluate the safety of the vehicle-grade chip through the functional safety analysis method at the design stage, and verify the protective effect of the safety mechanism of the chip on the vehicle-grade chip, which can guide the work of the vehicle-grade chip designers.

Authors

Institutions

Publication Details

Published
2025-01-16
DOI
https://doi.org/10.1117/12.3044974
Citations
1
Primary Topic
VLSI and Analog Circuit Testing
Type
article
Field-Weighted Citation Impact
2.27
Controls
|||
ALL TIME
JAN
FEB
MAR
APR
MAY
JUN
JUL
AUG
SEP
OCT
article

A functional safety analysis approach for random hardware failure of automotive-grade chips

Cuiping Shao, Chun-Huat Heng, Shunxian Gao, Huiyun Li et al.
1 citations
VLSI and Analog Circuit Testing
2.27
article

A functional safety analysis approach for random hardware failure of automotive-grade chips

Cuiping Shao, Chun-Huat Heng, Shunxian Gao, Huiyun Li, Bin Wei
article en
1 citations

Abstract

Automotive Grade Chips need to take into account the effects of unintended failures during operation, such as open circuits caused by chip aging or flipped memory devices caused by particle bombardment. Therefore, in the design process of automotive-grade chips, it is necessary to evaluate their safety and reliability. In this paper, we analyze the failure sources of automotive-grade chips and classify them according to the failure modes, comprehensively consider the impacts of different safety mechanisms, qualitatively and quantitatively analyze the functional safety of automotive-grade chips under transient failures, and quantify the level of protection against failures of automotive-grade chips under the transient failure conditions by means of mathematical models and evaluation indexes. The experimental results prove that it is feasible to evaluate the safety of the vehicle-grade chip through the functional safety analysis method at the design stage, and verify the protective effect of the safety mechanism of the chip on the vehicle-grade chip, which can guide the work of the vehicle-grade chip designers.

Shenzhen University (CN), Beijing Microelectronics Technology Institute (CN), Shenzhen Institutes of Advanced Technology (CN), Shenzhen Technology University (CN)
Openalex Percentile: Top 19%
VLSI and Analog Circuit Testing
2.27
AI Navigator

Ask Laika to Summarize, Analyze, and Connect papers live on the map.

Summarize Papers & Methodologies

Extract key findings, datasets, and comparative methods across publications.

Benchmark Rankings & Visual Analytics

Rank top research institutions, authors, funders, topics, and journals by Field-Weighted Citation Impact (FWCI) and paper volume with instant charts.

Connect Distant Disciplines

Bridge topological clusters on the map to find hidden collaborative intersections.

A functional safety analysis approach for random hardware failure of automotive-grade chips — Cuiping Shao, Chun-Huat Heng, et al. · (2025) | TGRS Research Map | TGRS