Design and Implementation of a High-speed GJB289A Bus Module Based on Micro-encapsulation

As Moore's Law continues to extend, the performance of electronic products has increased exponentially. The technology of GJB289A bus has also moved towards miniaturization, high integration and systematization with advanced packaging technology. Airborne systems also place higher demands on product performance to meet the ever-changing application needs of battlefield environments. Therefore, it is urgent to design a high-performance, high-reliability, miniaturized high-speed GJB289A bus system to meet current application requirements and give the GJB289A bus new vitality. The design in paper uses a high-performance SoPC processing chip and a micro-package bus processing chip to realize a universal GJB289A bus system. The circuit has passed high temperature, low temperature, vibration, and environmental stress screening tests, as well as user-level applications, and can meet the system's requirements on high real-time and high reliability.