Modulation of Interface Fixed Charge on AlON/SiO<sub>2</sub>/SiC with In-Situ Nitrogen Doping

Traditional thermally grown SiO2 gate oxide layers in SiC power MOSFETs are prone to breakdown, reduced carrier mobility, and threshold voltage instability. Replacing SiO2 with high-k gate dielectrics in SiC power MOSFETs reduces the electric field within the oxide and enhances the carrier channel mobility by incorporating a thin SiO2 layer, with the AlON film's low trap chargedensity further improving threshold voltage stability. The PEALD-grown AlON films, characterized by the presence of negative fixed charges, cause a positive shift in the flatband voltage, complicating the design of threshold voltages. This paper investigates the modulation of fixed charges in PEALD grown AlON films by nitrogen doping, reveal a linear increase in flatband voltage with effective oxide thickness. X-rayphotoelectron spectroscopy (XPS) shows that carbon impurities are concentrated at the SiO<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</inf>/AlON interface, where nitrogen incorporation enhances the formation of C-N bonds, effectively suppressing interface charges. Nitrogen doping process adjustment impacts C-N bond formation proportion. Alternately introducing NH3 and O2 (not simultaneously) promotes it, increasing the proportion from 8.99% to 13.17%. This creates a better reaction environment, reducing side reactions and enhancing efficiency and selectivity. With an PEALD Alternating growth process, the negative fixed charge density is suppressed to <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$-4.16\times 10^{12}\text{cm}^{-2}$</tex>, and the flatband voltage hysteresisremains below 0.1V regardless of post-deposition annealing. The process-grown SiO2/ AlON stack exhibits exceptional passivation properties, with an AlON bandgap of 6.53 eV and an oxide breakdownfield strength of 9.8 MV/cm. Even at an equivalent oxide thickness of merely 15 nm, the leakage current density is reduced to the <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\text{nA}/\text{cm}^{2}$</tex> level.

Authors

Institutions

Publication Details

Published
2024-11-18
DOI
https://doi.org/10.1109/sslchinaifws64644.2024.10835315
Primary Topic
Silicon Carbide Semiconductor Technologies
Type
article
Field-Weighted Citation Impact
0.00
Controls
|||
ALL TIME
JAN
FEB
MAR
APR
MAY
JUN
JUL
AUG
SEP
OCT
article

Modulation of Interface Fixed Charge on AlON/SiO2/SiC with In-Situ Nitrogen Doping

Cheng Zhang, Yufei Tian, Hang Su, Xinhong Cheng et al.
Silicon Carbide Semiconductor Technologies
article

Modulation of Interface Fixed Charge on AlON/SiO2/SiC with In-Situ Nitrogen Doping

Cheng Zhang, Yufei Tian, Hang Su, Xinhong Cheng, Zhongyu Liu, Zhen Li, Junhong Fen
article en

Abstract

Traditional thermally grown SiO2 gate oxide layers in SiC power MOSFETs are prone to breakdown, reduced carrier mobility, and threshold voltage instability. Replacing SiO2 with high-k gate dielectrics in SiC power MOSFETs reduces the electric field within the oxide and enhances the carrier channel mobility by incorporating a thin SiO2 layer, with the AlON film's low trap chargedensity further improving threshold voltage stability. The PEALD-grown AlON films, characterized by the presence of negative fixed charges, cause a positive shift in the flatband voltage, complicating the design of threshold voltages. This paper investigates the modulation of fixed charges in PEALD grown AlON films by nitrogen doping, reveal a linear increase in flatband voltage with effective oxide thickness. X-rayphotoelectron spectroscopy (XPS) shows that carbon impurities are concentrated at the SiO<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</inf>/AlON interface, where nitrogen incorporation enhances the formation of C-N bonds, effectively suppressing interface charges. Nitrogen doping process adjustment impacts C-N bond formation proportion. Alternately introducing NH3 and O2 (not simultaneously) promotes it, increasing the proportion from 8.99% to 13.17%. This creates a better reaction environment, reducing side reactions and enhancing efficiency and selectivity. With an PEALD Alternating growth process, the negative fixed charge density is suppressed to <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$-4.16\times 10^{12}\text{cm}^{-2}$</tex>, and the flatband voltage hysteresisremains below 0.1V regardless of post-deposition annealing. The process-grown SiO2/ AlON stack exhibits exceptional passivation properties, with an AlON bandgap of 6.53 eV and an oxide breakdownfield strength of 9.8 MV/cm. Even at an equivalent oxide thickness of merely 15 nm, the leakage current density is reduced to the <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\text{nA}/\text{cm}^{2}$</tex> level.

Shanghai Institute of Microsystem and Information Technology (CN)
Openalex Percentile: Top 76%
Silicon Carbide Semiconductor Technologies
AI Navigator

Ask Laika to Summarize, Analyze, and Connect papers live on the map.

Summarize Papers & Methodologies

Extract key findings, datasets, and comparative methods across publications.

Benchmark Rankings & Visual Analytics

Rank top research institutions, authors, funders, topics, and journals by Field-Weighted Citation Impact (FWCI) and paper volume with instant charts.

Connect Distant Disciplines

Bridge topological clusters on the map to find hidden collaborative intersections.