Simulation on AlN/GaN/AlN/GaN Planar HEMT and Fin-HEMT for Low-Voltage Applications

For low-voltage RF applications, in this letter, planar double-channel AlN/GaN HEMT (PDC HEMT) is researched based on the planar single-channel AIN/GaN HEMT (PSC HEMT). Compared with PSC HEMT, PDC HEMT enhances the output current density <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$(\mathrm{I}_{\mathrm{d}})$</tex> effectively, however the knee voltage <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$(\mathrm{V}_{\mathrm{k}})$</tex> increases. Subsequently, double-channel AIN/GaN HEMT with Fin structure (FDC HEMT) is researched with effectively increased electric field and reduced <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\mathrm{V}_{\mathrm{k}}$</tex> The device with a Fin width <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$(\mathrm{W}_{\text{Fin}})$</tex> of 100 nm exhibits the lowest <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\mathrm{V}_{\mathrm{k}}$</tex>, only 0.9 V. Both comparison of simulation results of PSC HEMT and PDC HEMT and the effect of <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\mathrm{W}_{\text{Fin}}$</tex> on Vi of FDC HEMT is exported in this letter. Simulation results show that PDC HEMT increases the maximum output current density (Id.max) to 3601 mA/mm, but the <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\mathrm{V}_{\mathrm{k}}$</tex> increases to 1.34 V. FDC HEMT effectively increases the electric field within the channel, reducing the <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\mathrm{V}_{\mathrm{k}}$</tex>. The FDC HEMT with 100 nm <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\mathrm{W}_{\text{Fin}}$</tex> reduces <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\mathrm{V}_{\mathrm{k}}$</tex> to 0.9 V. Therefore, PDC HEMT can effectively enhance the output current and FDC HEMT can effectively reduce <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\mathrm{V}_{\mathrm{k}}$</tex>, which is beneficial to improving device performance.

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Published
2024-11-18
DOI
https://doi.org/10.1109/sslchinaifws64644.2024.10835385
Primary Topic
GaN-based semiconductor devices and materials
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article
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article

Simulation on AlN/GaN/AlN/GaN Planar HEMT and Fin-HEMT for Low-Voltage Applications

Yuwei Zhou, Can Gong, Minhan Mi, Xingan Jiang et al.
GaN-based semiconductor devices and materials
article

Simulation on AlN/GaN/AlN/GaN Planar HEMT and Fin-HEMT for Low-Voltage Applications

Yuwei Zhou, Can Gong, Minhan Mi, Xingan Jiang, Xiao‐Hua Ma, Tianhao Liu
article en

Abstract

For low-voltage RF applications, in this letter, planar double-channel AlN/GaN HEMT (PDC HEMT) is researched based on the planar single-channel AIN/GaN HEMT (PSC HEMT). Compared with PSC HEMT, PDC HEMT enhances the output current density <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$(\mathrm{I}_{\mathrm{d}})$</tex> effectively, however the knee voltage <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$(\mathrm{V}_{\mathrm{k}})$</tex> increases. Subsequently, double-channel AIN/GaN HEMT with Fin structure (FDC HEMT) is researched with effectively increased electric field and reduced <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\mathrm{V}_{\mathrm{k}}$</tex> The device with a Fin width <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$(\mathrm{W}_{\text{Fin}})$</tex> of 100 nm exhibits the lowest <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\mathrm{V}_{\mathrm{k}}$</tex>, only 0.9 V. Both comparison of simulation results of PSC HEMT and PDC HEMT and the effect of <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\mathrm{W}_{\text{Fin}}$</tex> on Vi of FDC HEMT is exported in this letter. Simulation results show that PDC HEMT increases the maximum output current density (Id.max) to 3601 mA/mm, but the <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\mathrm{V}_{\mathrm{k}}$</tex> increases to 1.34 V. FDC HEMT effectively increases the electric field within the channel, reducing the <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\mathrm{V}_{\mathrm{k}}$</tex>. The FDC HEMT with 100 nm <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\mathrm{W}_{\text{Fin}}$</tex> reduces <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\mathrm{V}_{\mathrm{k}}$</tex> to 0.9 V. Therefore, PDC HEMT can effectively enhance the output current and FDC HEMT can effectively reduce <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\mathrm{V}_{\mathrm{k}}$</tex>, which is beneficial to improving device performance.

Xidian University (CN)
Affordable and clean energy
Openalex Percentile: Top 84%
GaN-based semiconductor devices and materials
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