Thermodynamic Simulation of Hybrid Bonding of 4×4 Micro-LED Arrays Based on Flip-Chip Bonding

Micro-LED technology has gradually developed from the initial experimental stage to commercial applications. Manufacturing processes continue to improve, especially in terms of chip size, pixel density and packaging technology, and significant progress has been made. However, Micro-LED flip-chip bonding technology still faces some challenges of yield and reliability. In this paper, ANSYS software is used to simulate the hybrid bonding thermodynamics of Micro-LED based on flip-chip bonding, and the influence of different metal protrusion heights on the bonding bumps stress under filled PI is simulated. The results show that filling PI can significantly reduce the stress in the bumps bonding zone. Changing the protrusion height has different degree of influence on the stress of the bumps. When the protrusion height is 2 µm, the stress of the bumps is minimum. In this paper, simulations are used to study the bumps stress under different conditions during the preparation of Micro-LED hybrid bonding. this provides a theoretical basis for reducing the stress and stress concentration. It can improve the bonding strength and yield of Micro-LED.