A Fast Measurement Method of Temperature Field on High Temperature Surface Based on Color CCD

The rapid and accurate measurement of high-temperature fields holds significant implications in the realms of aero-engine measurement, metal welding, and the metallurgical industry. This paper proposes a method for rapid temperature field measurement in high-temperature environments, leveraging a color CCD. Initially, we analyze the sources of error in high-temperature measurement scenarios. Subsequently, we design a rapid temperature field measurement method for high-temperature environments using a Multi-layer Perceptron, which includes model construction and dataset creation that takes into account the sources of high-temperature errors. Using the proposed method, we invert the temperature field to obtain visualization data. The efficacy of the temperature field measurement method is validated and tested through high-temperature experiments using a standard blackbody furnace. Experimental results indicate that the proposed temperature measurement method can measure up to <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$2000^{\circ}C$</tex>, while maintaining a relative low measurement error. This represents a substantial improvement over traditional least squares fitting temperature measurement methods in high-temperature scenarios.