Adhesion Enhancement for Wearable Stretchable Electronics by Diffusing the Curing Inhibitor

Advancements in wearable technology have boosted the demand for stretchable electronics with good adhesion to the skin and adaptability to movement. Traditional methods that rely on the use of with adhesives or hydrogels are problematic because they require photolithographic machining, and are characterized by deteriorating adhesion and uneven surface bonding. This study led to the introduction of a five-step physical bonding process that enables the fabrication of circuits that remain conductive under 30% elongation. In addition, adhesion is enhanced by more than 150% by diffusing the curing inhibitor. The improved cost-efficiency and productivity offered by this simplified approach make it highly suitable for the production of wearable sensors.