Twin spacing manipulation of (111)-oriented nanotwinned copper <i>via</i> aeration flow control in a high-speed direct-current electroplating system with thiol organic additives
It is a challenge to develop a cost-effective and time-efficient process for manufacturing nanotwinned copper foil with the precise control of twin spacing, a crucial determinant of nanotwinned copper properties.
Authors
- Hao-Yu Ku (ORCID: https://orcid.org/0000-0002-5643-8285)
- Chi‐Chang Hu (ORCID: https://orcid.org/0000-0002-4308-8474)
- Kuan-Ling Liu
- H. L. Tsou
- Hsiang-Sheng Wei
Institutions
- National Tsing Hua University (TW)
Publication Details
- Journal
- Journal of Materials Chemistry A
- Published
- 2025-01-01
- DOI
- https://doi.org/10.1039/d4ta07905a
- Citations
- 6
- Primary Topic
- Electrodeposition and Electroless Coatings
- Type
- article
- Field-Weighted Citation Impact
- 4.38
Funders
- National Science and Technology Council