Via Assisted Dual-Band Array With High Isolation

This work reports a novel design technique of a dual-band rectangular patch array with very high decoupling behavior. The reactive impedance properties of via arrays have been systematically leveraged to improve isolation behavior. The offset in the via placement in two patches helps in achieving dual-band resonance. As the via is internally integrated into the patch geometry itself, it avoids the additional increment of the array’s physical area due to the absence of parasitic decoupling structures between the patches. Another advantage of the proposed array is its enhancement of the realized gain over the operating frequency bands. The extensibility of this new technique has been investigated. Such dual-band, high-isolation arrays can find applications in sensing technologies, cellular base stations, etc.