Design of a Highly Integrated Ka-Band Phased Array Antenna-in-Package (AiP)

To address the issues of high connector loss and low system integration between the traditional active phased array antenna and the T/R modules, this paper designs a broadband integrated phased array antenna-in-package (AiP) module. Leveraging the advantages of Low-Temperature Co-fired Ceramic (LTCC) substrates, which offer strong multilayer wiring capabilities and the ability to form complex cavity structures, the antenna array and T/R modules are highly integrated. The chip stacking layout further enhances substrate utilization and improves the overall integration of the components. The AiP module operates within a bandwidth of 27.5-31 GHz, includes a 2×2 antenna array, and has dimensions of 10mm×10mm×5mm. Simulation results show that the receive link gain is greater than 25 dB, and the input/output voltage standing wave ratio (VSWR) is less than 1.65, demonstrating excellent electrical performance.