Application of SOI Compact Model to a-IGZO Technology

The SPICE model serves as a crucial link between semiconductor process and circuit design. The first industry standardized SPICE model for silicon semiconductor transistors was developed in 1996. In the context of flexible electronics, a standardized SPICE model is necessary to accurately describe the electrical behaviour of flexible electronic devices and enable the design of flexible electronic circuits. The Silicon-on-Insulator (SOI) model has been proposed as a suitable SPICE model for flexible a-IGZO TFT devices, which offers unique advantages over the traditional TFT SPICE model.