Thermal Design of GaN Power Devices in Wafer Level Chip Scale Package (WLCSP) for Automotive EPS Motor Drivers

Since wafer-level chip-scale packages (WLCSPs) offer advantages of reducing parasitic inductance and package size, as well as enhancing thermal conductivity, this work comprises gallium nitride (GaN) devices in a WLCSP for automotive electric power steering (EPS) motor drivers. We present a thermal design of WLCSP GaN power transistor devices. The effectiveness and usefulness of our design are verified through thermal performance experiments and an in-vehicle EPS evaluation of steering assistance performance.