Effect of Carbon on the Formation of Cobalt Silicide and Thermal Stability for DRAM Application: A Comparative Study on PVD and CVD Methods

The improved thermal stability of cobalt silicide (CoSi <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$_{\text{2}}$</tex-math> </inline-formula> ) becomes pivotal with the introduction of a 4F <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$^{\text{2}}$</tex-math> </inline-formula> cell architecture, featuring a vertical pillar transistor for DRAM application. To tackle this challenge, carbon preamorphization implantation (C PAI) was employed. This study systematically investigates the effects of C PAI on both the formation and thermal stability of CoSi <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$_{\text{2}}$</tex-math> </inline-formula> , taking into account distinct cobalt deposition methods, namely, physical vapor deposition (PVD) and chemical vapor deposition (CVD). Results demonstrate that the presence of carbon delays the nucleation temperature of CoSi <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$_{\text{2}}$</tex-math> </inline-formula> approximately 50 <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$^{\circ}$</tex-math> </inline-formula> C and significantly enhances the morphology and thermal stability of CoSi <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$_{\text{2}}$</tex-math> </inline-formula> for PVD Co. These observed effects can be explained by the segregation of carbon atoms at the grain boundaries and CoSi <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$_{\text{2}}$</tex-math> </inline-formula> /Si interface. However, the introduction of carbon has a detrimental effect for CVD Co. The variations in results are attributed to variations in the deposition mechanism. This insight provides valuable considerations for optimizing the thermal stability of CoSi <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$_{\text{2}}$</tex-math> </inline-formula> s in the context of future DRAM devices.

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Publication Details

Journal
IEEE Transactions on Electron Devices
Published
2025-01-10
DOI
https://doi.org/10.1109/ted.2024.3523263
Citations
1
Primary Topic
Semiconductor materials and devices
Type
article
Field-Weighted Citation Impact
0.73
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article

Effect of Carbon on the Formation of Cobalt Silicide and Thermal Stability for DRAM Application: A Comparative Study on PVD and CVD Methods

Shujuan Mao, Weibing Liu, Chao Zhao, Xianglie Sun et al.
1 citations
IEEE Transactions on Electron Devices
Semiconductor materials and devices
0.73
article

Effect of Carbon on the Formation of Cobalt Silicide and Thermal Stability for DRAM Application: A Comparative Study on PVD and CVD Methods

Shujuan Mao, Weibing Liu, Chao Zhao, Xianglie Sun, Feng Xu, Guilei Wang, Jianfeng Gao, Xiaolei Wang, Chen Xu, Junfeng Li, Jinbiao Liu, Jun Luo, Yan‐Ping He
article en
1 citations

Abstract

The improved thermal stability of cobalt silicide (CoSi <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$_{\text{2}}$</tex-math> </inline-formula> ) becomes pivotal with the introduction of a 4F <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$^{\text{2}}$</tex-math> </inline-formula> cell architecture, featuring a vertical pillar transistor for DRAM application. To tackle this challenge, carbon preamorphization implantation (C PAI) was employed. This study systematically investigates the effects of C PAI on both the formation and thermal stability of CoSi <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$_{\text{2}}$</tex-math> </inline-formula> , taking into account distinct cobalt deposition methods, namely, physical vapor deposition (PVD) and chemical vapor deposition (CVD). Results demonstrate that the presence of carbon delays the nucleation temperature of CoSi <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$_{\text{2}}$</tex-math> </inline-formula> approximately 50 <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$^{\circ}$</tex-math> </inline-formula> C and significantly enhances the morphology and thermal stability of CoSi <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$_{\text{2}}$</tex-math> </inline-formula> for PVD Co. These observed effects can be explained by the segregation of carbon atoms at the grain boundaries and CoSi <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$_{\text{2}}$</tex-math> </inline-formula> /Si interface. However, the introduction of carbon has a detrimental effect for CVD Co. The variations in results are attributed to variations in the deposition mechanism. This insight provides valuable considerations for optimizing the thermal stability of CoSi <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$_{\text{2}}$</tex-math> </inline-formula> s in the context of future DRAM devices.

IEEE Transactions on Electron DevicesVol. 72(2)
Chinese Academy of Sciences (CN), Institute of Microelectronics (CN), University of Chinese Academy of Sciences (CN)
Openalex Percentile: Top 32%
Semiconductor materials and devices
0.73
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