Effect of Carbon on the Formation of Cobalt Silicide and Thermal Stability for DRAM Application: A Comparative Study on PVD and CVD Methods
The improved thermal stability of cobalt silicide (CoSi <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$_{\text{2}}$</tex-math> </inline-formula> ) becomes pivotal with the introduction of a 4F <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$^{\text{2}}$</tex-math> </inline-formula> cell architecture, featuring a vertical pillar transistor for DRAM application. To tackle this challenge, carbon preamorphization implantation (C PAI) was employed. This study systematically investigates the effects of C PAI on both the formation and thermal stability of CoSi <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$_{\text{2}}$</tex-math> </inline-formula> , taking into account distinct cobalt deposition methods, namely, physical vapor deposition (PVD) and chemical vapor deposition (CVD). Results demonstrate that the presence of carbon delays the nucleation temperature of CoSi <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$_{\text{2}}$</tex-math> </inline-formula> approximately 50 <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$^{\circ}$</tex-math> </inline-formula> C and significantly enhances the morphology and thermal stability of CoSi <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$_{\text{2}}$</tex-math> </inline-formula> for PVD Co. These observed effects can be explained by the segregation of carbon atoms at the grain boundaries and CoSi <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$_{\text{2}}$</tex-math> </inline-formula> /Si interface. However, the introduction of carbon has a detrimental effect for CVD Co. The variations in results are attributed to variations in the deposition mechanism. This insight provides valuable considerations for optimizing the thermal stability of CoSi <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$_{\text{2}}$</tex-math> </inline-formula> s in the context of future DRAM devices.
Authors
- Shujuan Mao (ORCID: https://orcid.org/0000-0002-3350-1659)
- Weibing Liu (ORCID: https://orcid.org/0000-0003-4885-1675)
- Chao Zhao (ORCID: https://orcid.org/0009-0009-2026-2714)
- Xianglie Sun (ORCID: https://orcid.org/0000-0002-2177-9637)
- Feng Xu (ORCID: https://orcid.org/0000-0001-7727-0488)
- Guilei Wang (ORCID: https://orcid.org/0000-0002-1311-8863)
- Jianfeng Gao (ORCID: https://orcid.org/0000-0001-5540-7228)
- Xiaolei Wang
- Chen Xu (ORCID: https://orcid.org/0000-0002-3015-759X)
- Junfeng Li (ORCID: https://orcid.org/0000-0002-6272-9169)
- Jinbiao Liu
- Jun Luo (ORCID: https://orcid.org/0000-0002-4136-384X)
- Yan‐Ping He
Institutions
- Chinese Academy of Sciences (CN)
- Institute of Microelectronics (CN)
- University of Chinese Academy of Sciences (CN)
Publication Details
- Journal
- IEEE Transactions on Electron Devices
- Published
- 2025-01-10
- DOI
- https://doi.org/10.1109/ted.2024.3523263
- Citations
- 1
- Primary Topic
- Semiconductor materials and devices
- Type
- article
- Field-Weighted Citation Impact
- 0.73