Monolithic Integration of p-GaN HEMT With Antiparallel Lateral Rectifier to Reduce the Negative Resistance Effect

p-GaN HEMTs are favored for bridge topology applications where they act as the freewheeling transistors to commute the current during the dead time. However, the <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">i<sub>DS</sub></i> , <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">v<sub>DS</sub></i> and <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">v<sub>GS</sub></i> oscillations at this period are observed and may introduce EMI problems. In this paper, we have demonstrated the presence of the negative resistance effect in p-GaN HEMTs by small signal analysis and revealed the origin of the abovementioned oscillations. The negative resistance comes from the unique reverse conduction mechanism of p-GaN HEMT and strengthen the oscillation of the driving current <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">i<sub>G</sub></i> . According to the derivation formula of the negative resistance, it can be reduced by paralleling a resistor between the drain and source of the freewheeling transistor. Thus, an anti-parallel lateral rectifier (LR) is monolithically integrated with the p-GaN HEMT to reduce the negative resistance. A synchronous buck converter was constructed to verify the effectiveness in a circuit-level application. The experiment results show that the negative resistance has a 11% reduction and the oscillation amplitude of the <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">i<sub>DS</sub></i> is reduced by 60% with 1% chip area of LR. Meanwhile, the high switching speed of the p-GaN HEMT is not affected.

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Publication Details

Journal
IEEE Transactions on Power Electronics
Published
2025-01-10
DOI
https://doi.org/10.1109/tpel.2025.3528180
Citations
1
Primary Topic
GaN-based semiconductor devices and materials
Type
article
Field-Weighted Citation Impact
1.26
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article

Monolithic Integration of p-GaN HEMT With Antiparallel Lateral Rectifier to Reduce the Negative Resistance Effect

Junhong Feng, Yufei Tian, Xuetong Zhou, Xinhong Cheng et al.
1 citations
IEEE Transactions on Power Electronics
GaN-based semiconductor devices and materials
1.26
article

Monolithic Integration of p-GaN HEMT With Antiparallel Lateral Rectifier to Reduce the Negative Resistance Effect

Junhong Feng, Yufei Tian, Xuetong Zhou, Xinhong Cheng, Li Zheng, Lingyan Shen, Yuhua Quan, Yuehui Yu, Wenyu Lu, Ruiyan Pan
article en
1 citations

Abstract

p-GaN HEMTs are favored for bridge topology applications where they act as the freewheeling transistors to commute the current during the dead time. However, the <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">i<sub>DS</sub></i> , <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">v<sub>DS</sub></i> and <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">v<sub>GS</sub></i> oscillations at this period are observed and may introduce EMI problems. In this paper, we have demonstrated the presence of the negative resistance effect in p-GaN HEMTs by small signal analysis and revealed the origin of the abovementioned oscillations. The negative resistance comes from the unique reverse conduction mechanism of p-GaN HEMT and strengthen the oscillation of the driving current <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">i<sub>G</sub></i> . According to the derivation formula of the negative resistance, it can be reduced by paralleling a resistor between the drain and source of the freewheeling transistor. Thus, an anti-parallel lateral rectifier (LR) is monolithically integrated with the p-GaN HEMT to reduce the negative resistance. A synchronous buck converter was constructed to verify the effectiveness in a circuit-level application. The experiment results show that the negative resistance has a 11% reduction and the oscillation amplitude of the <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">i<sub>DS</sub></i> is reduced by 60% with 1% chip area of LR. Meanwhile, the high switching speed of the p-GaN HEMT is not affected.

IEEE Transactions on Power ElectronicsVol. 40(5)
Chinese Academy of Sciences (CN), Lam Research (United States) (US), Shanghai Institute of Microsystem and Information Technology (CN), University of Chinese Academy of Sciences (CN)
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GaN-based semiconductor devices and materials
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