Study on the multifield coupling mechanism in laser cladding of 316L under different elevation angles of the laser head
The key to repair and strengthen mechanical parts based on laser cladding technology lies in the preparation of an excellent cladding layer. However, the shape of general mechanical parts is relatively complex, involving the intersection of various curved structures. It is significant to explore the instantaneous action mechanism of multifield coupling during the cladding process under different elevation angles of the laser head for the preparation of the high-quality cladding layer. In this paper, a multifield coupled numerical model of laser cladding 316L powder under different elevation angles of the laser head was established, and the instantaneous evolution of multifield coupled laser cladding under different elevation angles was revealed. The calculation shows that the elevation angle of the laser head has significant effects on the temperature field and flow field but has relatively weak effects on the stress field and phase transition field. The thickness and depth of the cladding layer can be effectively regulated by changing the elevation angle of the laser head. This study provides a significant theoretical basis for determining the control parameters of cladding layer morphology and lays a significant theoretical foundation for expanding the extensive application of laser cladding technology in the field of repair and strengthening.
Authors
- Han Sun (ORCID: https://orcid.org/0009-0008-1517-6347)
- Cong Wang (ORCID: https://orcid.org/0000-0001-6424-167X)
- Chang Li (ORCID: https://orcid.org/0000-0002-8882-6055)
- Xing Han
Institutions
- University of Science and Technology Liaoning (CN)
- Shenyang Institute of Automation (CN)
- Chinese Academy of Sciences (CN)
Publication Details
- Journal
- Journal of Laser Applications
- Published
- 2025-01-09
- DOI
- https://doi.org/10.2351/7.0001672
- Primary Topic
- Additive Manufacturing Materials and Processes
- Type
- article
- Field-Weighted Citation Impact
- 0.00