ORNL TSL Evaluations for ENDF/B-IX [Slides]

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Published
2024-08-14
DOI
https://doi.org/10.2172/2497262
Primary Topic
Copper Interconnects and Reliability
Type
article
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article

ORNL TSL Evaluations for ENDF/B-IX [Slides]

Kemal Ramić, Chris Chapman, Iyad Al-Qasir
Copper Interconnects and Reliability
article

ORNL TSL Evaluations for ENDF/B-IX [Slides]

Kemal Ramić, Chris Chapman, Iyad Al-Qasir
article en

Abstract

No abstract available for this paper.
Oak Ridge National Laboratory (US)
U.S. Department of Energy, Battelle, National Nuclear Security Administration, Oak Ridge National Laboratory
Openalex Percentile: Top 85%
Copper Interconnects and Reliability
DOIOpen Access PDFOpenAlex
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ORNL TSL Evaluations for ENDF/B-IX [Slides] — Kemal Ramić, Chris Chapman, et al. · (2024) | TGRS Research Map | TGRS