Near-infrared confocal laser scanning microscope system with InGaAs focal plane array

Abstract Today, more and more silicon-based chips apply new flip-chip packages to accommodate the high density and power consumption requirements of electronic products. In this case, defect detection in the flip-chip package is essential. However, silicon-based materials are opaque to visible wavelengths, making it difficult to identify defects within the chip or wafer. By utilizing the property that near-infrared (NIR) light can pass through silicon, NIR confocal imaging is a promising non-destructive method to detect defects inside silicon chips. In this study, we report an integrated NIR confocal scanning microscope system consisting of a NIR microscope and a NIR confocal scanning system, which uses an InGaAs focal plane array as a detector instead of the conventional combination of a small pinhole and a photo-multiplier tube or an avalanche photodiode. The proposed confocal scanner can detect devices of different sizes in the field of view, obtain high-contrast and three-dimensional images of the internal structure, and can be effectively employed as an in-line inspection system for detecting surface and internal defects during chip manufacturing.

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Publication Details

Journal
Measurement Science and Technology
Published
2025-01-09
DOI
https://doi.org/10.1088/1361-6501/ada81e
Citations
1
Primary Topic
Advanced Fluorescence Microscopy Techniques
Type
article
Field-Weighted Citation Impact
1.63
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article

Near-infrared confocal laser scanning microscope system with InGaAs focal plane array

J. K. Liu, Shuzhen Fan, H.X. Li, Xian Zhao et al.
1 citations
Measurement Science and Technology
Advanced Fluorescence Microscopy Techniques
1.63
article

Near-infrared confocal laser scanning microscope system with InGaAs focal plane array

J. K. Liu, Shuzhen Fan, H.X. Li, Xian Zhao, Cheng Fei, Yunxia Liu, Yongfu Li, Shuolin Yang, Yakui Dong
article en
1 citations

Abstract

Abstract Today, more and more silicon-based chips apply new flip-chip packages to accommodate the high density and power consumption requirements of electronic products. In this case, defect detection in the flip-chip package is essential. However, silicon-based materials are opaque to visible wavelengths, making it difficult to identify defects within the chip or wafer. By utilizing the property that near-infrared (NIR) light can pass through silicon, NIR confocal imaging is a promising non-destructive method to detect defects inside silicon chips. In this study, we report an integrated NIR confocal scanning microscope system consisting of a NIR microscope and a NIR confocal scanning system, which uses an InGaAs focal plane array as a detector instead of the conventional combination of a small pinhole and a photo-multiplier tube or an avalanche photodiode. The proposed confocal scanner can detect devices of different sizes in the field of view, obtain high-contrast and three-dimensional images of the internal structure, and can be effectively employed as an in-line inspection system for detecting surface and internal defects during chip manufacturing.

Measurement Science and TechnologyVol. 36(3)
Qingdao University (CN), Ministry of Education (ME)
Affordable and clean energy
Openalex Percentile: Top 17%
Advanced Fluorescence Microscopy Techniques
1.63
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