An approach for analyzing IC quality of wafer level based on its circuit probe data set

Circuit probe (CP) test data for a wafer encapsulates the comprehensive electrical characteristics of each integrated circuit (IC) chip, making the accurate analysis of this data set crucial for quality control within the semiconductor industry. This paper introduces a novel methodology for analyzing the quality of IC dies based on their CP data set. Initially, a three-dimensional quality matrix, termed wafer_Q_set, is constructed by extracting quality information from the CP test data set. Subsequently, this three-dimensional wafer_Q_set is reduced to two dimensions utilizing fractal theory and transformed into a Comprehensive Quality Spectrum (CQS) through the application of the quality spectrum method. The CQS visually represents the overall quality information of the CP test data set, facilitating qualitative analysis. Finally, the quality information within the CQS is examined quantitatively, enabling a comprehensive analysis of the entire batch of chips and the exploration of potential fault correlations within the data. The effectiveness, accuracy, and efficiency of the proposed approach are validated using a CP data set from an actual IC chip foundry.