Shear Strength Test and Analysis of ITO Sputtering Target Assemblies

Cracks and defects in the ITO (Indium tin oxide) sputtering target process arise from uneven strain distribution and stress concentration, which are caused by differences in the coefficients of thermal expansion and elastic moduli between materials, as well as improper bonding setup conditions. This study investigates the optimal bonding conditions for the ITO sputtering target process through shear tests. The tests were conducted on ITO target specimens bonded under 24 different conditions. The results indicate that surface roughness and adhesive thickness are the most significant factors affecting shear strength, with metalizing treatment also having a consistent influence. The optimal bonding conditions for improving the reliability of the ITO target process and minimizing defects are surface roughness in the range of 100-200, adhesive thickness of 0.1 mm, and the application of metalizing treatment.