Research on the mechanism of a high robustness pressure sensor based on heat conduction
In this paper, a structure of high robustness pressure sensor based on heat conduction is proposed and its mechanism is studied. The temperature field in the structure of a high robustness pressure transducer based on heat conduction is calculated by COMSOL, and the temperature difference under the corresponding pressure is calculated. The calculation results based on the three-dimensional physical model of the sensor show that the temperature difference of the highly robust pressure sensor based on heat conduction decreases with the increase of pressure, and the pressure of the sensor is inversely proportional to the temperature difference, The temperature sensitivity of the high robustness pressure sensor based on heat conduction in the range of 0 ~ 49N is -0.021 K/N and the nonlinearity is 11.02%. The temperature sensitivity of the high robustness pressure sensor based on heat conduction in the range of 50 ~ 60N is -1.184 K/N and the nonlinearity is 7.85%. Through the establishment of the three-dimensional physical model structure of the high-robustness pressure sensor based on heat conduction and the calculation results of the sensor, the mechanism of the high-robustness pressure sensor based on heat conduction is revealed, which lays a theoretical foundation for the subsequent optimization of the parameters and structure of this kind of sensor.
Authors
- Yonghao Zhang (ORCID: https://orcid.org/0000-0002-0683-7050)
- Linhua Piao
- Jiahao Sun (ORCID: https://orcid.org/0009-0008-8669-8038)
Institutions
- Ministry of Education of the People's Republic of China (CN)
- Ministry of Education Science and Technology (MW)
- Sensors (United States) (US)
Publication Details
- Journal
- IET conference proceedings.
- Published
- 2025-01-01
- DOI
- https://doi.org/10.1049/icp.2024.2753
- Primary Topic
- Advanced Sensor Technologies Research
- Type
- article
- Field-Weighted Citation Impact
- 0.00