Fatigue life prediction of Dual Flat No-Lead packaging component solder joint

With the rapid development of electronic micro-assembly technology, the reliability of interconnected solder joints has become a crucial factor in determining overall equipment reliability. This paper focuses on a type of Dual Flat No-lead (DFN) packaging component that failed during actual service. Through temperature cycling life tests, a fatigue life prediction formula for this type of component was developed. The effectiveness of this formula was confirmed by comparing it with the fatigue life prediction results observed during actual service. This formula can also be used to predict the fatigue life of Square Flat No-lead (QFN) packaging component solder joints.