Multilayer Ceramic Capacitor Source Model Application in Acoustic Noise Prediction

In this article, a multi-physics modeling methodology is presented for predicting the acoustic noise induced by a multi-layer ceramic capacitor (MLCC) in mobile electronic devices. The modeling process involves using a prescribed methodology to extract the equivalent source at the resonance frequencies of a printed circuit board (PCB) and then deriving the broadband source multi-physics Electrical Input Mechanical Output (EIMO) model. Subsequently, the obtained EIMO model is integrated into PCB vibration simulations, and the resulting vibration data are used for acoustic simulations. The predicted A-weighted sound pressure level (SPL) excited by the MLCC EIMO model accurately represented the acoustic noise generated by a tested MLCC, achieving a correlation with measurements of 2 dB difference at resonant modes. This approach offers insights into mitigating MLCC-induced acoustic noise in electronic systems and facilitates more effective design strategies.