Research on reliability simulation based on electronic product digital mock-up

This paper discusses a reliability simulation methodology that integrates thermal simulation, vibration simulation, and fault physical modeling to develop CAD, CFD, and FEA digital prototypes of products. By subjecting these digital prototypes to environmental stresses such as temperature and vibration, stress analysis and damage assessment are performed. This process identifies potential weak points within the product, allowing for design enhancements that improve product reliability. Additionally, this method enables the prediction of the average time to first failure, providing a foundation for virtual verification of product reliability. It also supports the parallel collaborative design of product functionality and reliability. An application example of this reliability simulation method is provided to illustrate its practical implications.